- Micron has started shipping samples of its next-generation HBM4 memory.
- The new modules deliver 2.8TB/s bandwidth, beating Samsung and SK Hynix.
- Micron plans HBM4E with customizable base logic die for major customers.
- Rising AI demand helped Micron’s HBM revenue reach an annualized $8 billion.
Micron has taken a bold lead in the high-bandwidth memory race. The company revealed it has started shipping samples of its next-generation HBM4 memory.
According to CEO Sanjay Mehrotra, the new chips deliver more than 2.8 terabytes per second of bandwidth. That figure surpasses both the official JEDEC HBM4 specification of 2 terabytes per second and the offerings from Samsung and SK Hynix.
The announcement came during Micron’s Q4 2025 earnings call. The company also revealed strong financial growth in its memory business, driven largely by the rising demand for artificial intelligence workloads.
Setting a New Benchmark in Memory Speed
Micron’s HBM4 modules use advanced engineering to push pin speeds above 11 gigabits per second. That is a significant leap over the JEDEC baseline of 8 gigabits per second. The higher speed and efficiency could give Micron a competitive edge as AI and high-performance computing systems demand faster memory.
Mehrotra highlighted Micron’s use of 1-gamma DRAM technology, its own CMOS base die, and innovative packaging methods. These elements, he said, are critical to delivering both top performance and industry-leading energy efficiency.
Plans for HBM4E and Customization
Micron is not stopping with HBM4. The company also announced upcoming plans for HBM4E, a more flexible version of the technology. HBM4E will allow customers to customize the logic base die, tailoring the memory to specific needs such as lower latency or optimized packet routing.
This collaboration-driven approach marks the first time high-bandwidth memory will be offered with a custom base die. Major partners like Nvidia and AMD are expected to benefit by designing accelerators with tightly integrated memory stacks.
Mehrotra noted that these customized versions could also deliver better profitability for Micron. “Customization requires close collaboration with customers,” he said, adding that the company expects higher gross margins from tailored HBM4E solutions.
Riding the AI Wave to Higher Revenue
The surge in demand for high-bandwidth memory is closely tied to the expansion of artificial intelligence applications. Micron reported that revenue from HBM products reached nearly 2 billion dollars in the most recent quarter. That represents an annualized run rate of 8 billion dollars, a milestone that reflects the growing importance of this product line.
Earlier in 2025, Micron shared its ambition to capture a larger share of the projected 100 billion dollar HBM market. With the new HBM4 leading in raw bandwidth, Micron is positioning itself as a key supplier for next-generation AI accelerators and data center platforms.
Industry Competition Heats Up
While Micron is enjoying an early lead, Samsung and SK Hynix are also pushing forward with their own HBM4 designs. The competition in the high-bandwidth memory market is expected to intensify as more AI-focused chips come to market.
Despite the rivalry, Micron’s early shipments and performance gains are likely to strengthen its relationships with top customers. These include Nvidia, AMD, and other semiconductor firms eager for faster and more efficient memory solutions.
Mehrotra ended the earnings call on an optimistic note. He emphasized Micron’s strong fiscal year and highlighted the company’s focus on innovation and execution as it moves into the next phase of growth.
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